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VLSI-SoC: Technologies for Systems Integration [electronic resource] : 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, Florianpolis, Brazil, October 12-14, 2009, Revised Selected Papers / edited by Jȭrgen Becker, Marcelo Johann, Ricardo Reis.

Por: Colaborador(es): Tipo de material: TextoTextoSeries IFIP Advances in Information and Communication Technology ; 360 | IFIP Advances in Information and Communication Technology ; 360Editor: Berlin, Heidelberg : Springer Berlin Heidelberg, 2011Descripción: X, 202 p. online resourceTipo de contenido:
  • text
Tipo de medio:
  • computer
Tipo de soporte:
  • online resource
ISBN:
  • 9783642231209
Trabajos contenidos:
  • SpringerLink (Online service)
Tema(s): Formatos físicos adicionales: Sin títuloClasificación CDD:
  • 005.18 23
Clasificación LoC:
  • QA76.635
Recursos en línea: Springer eBooksResumen: This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianpolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
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This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianpolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.

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